mechanical specification maximum ratings & electrical characteristics data sheet no. BPTD-3000D-1A power over ethernet (poe) equipment protection 3.0 kp bipolar transient voltage suppressor diode cells tel.: (310) 767-1052 fax: (310) 767-7958 diotec electronics corp gardena, ca 90248 u.s.a 18020 hobart blvd., unit b breakdown voltage (i = 100 ma dc, tc = 25 c) r o parameter (test conditions) maximum recurrent peak reverse voltage non-repetitive peak forward surge current (half wave, single phase, 60 hz sine applied to rated load) repetitive peak reverse surge current (time constant = 10 msec duty cycle < 1.0%, tc = 25 c) o average rectified forward current (single phase, resistive load, 60 hz) maximum thermal resistance, junction to slug (note 1) junction operating & storage temperature range maximum dc reverse current (v = 20v dc, tc = 25 c) r o instantaneous forward voltage (i = 80a @300 sec pulse, t = 25 c) f c m o maximum dc blocking voltage working peak reverse voltage series number i r r q jc t ,t j stg v (br) v rwm v dc v rrm symbol 24 min / 32 max 200 0.8 -65 to +175 110 500 1.05 23 35 tvs3527d ratings volts c/w c amps units volts na i o i rsm i fsm 3.01 tvs35d 1.00 maximum typical notes: 1) single side cooled b a c passivation proprietary junction silver plated copper slugs silicon die die size: 0.185"dia. round dim a b c inches +/- nom 0.215 0.190 0.083 0.0030.003 0.004 ratings at 25 c ambient temperature unless otherwise specified. parameter series number symbol ratings i t test current (to determine v ) br breakdown voltage (cells begin to conduct) (see note 1) v br units bp3-23 2.0 33 (max) 91 min amps 20 2 volts ma amps 37.5 max volts 800 min 23.3 min +/- 5% features mechanical data rohs compliant void free vacuum die soldering for lowest electrical/thermal resistance and maximum mechanical strength &heat dissipation (solder voids: typical < 2%, max. < 10% of die area) round die for high power heavy duty performance high heat handling capability with very low thermal stress proprietary junction passivation for superior reliability and performance finish: soldering temperature: 282 c maximum mounting position: any polarity: bipolar o all external surfaces are silver plated for corrosion resistance superior solderability reverse stand off voltage (voltage at which i measured) r clamping voltage during a 10/1000 transient m s maximum current conducted during a transient 10/1000 s m v wm i ppm(10) maximum current conducted at v wm i r maximum current conducted during 8/20 s transient m i ppm(8) v c(8) clamping voltage during 8/20 s transient m v c(10) features mechanical data rohs compliant lowest electrical & thermal resistance - ideally suited for preventing overvoltage/overcurrent damage to power over ethernet (poe) equipment void free vacuum die soldering for lowest electrical/thermal resistance and maximum mechanical strength & heat dissipation (solder voids: typical < 2%, max. < 10% of die area) round die for high power heavy duty performance high heat handling capability with very low thermal stress proprietary junction passivation for superior reliability and performance finish: soldering temperature: 282 c maximum mounting position: any polarity: bipolar o all external surfaces are silver plated for corrosion resistance superior solderability notes: (1) diode cell breakdown voltage can be tailored to meet your specific application requirements. please contact us for details.
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